Bell Microproducts Teams with HP to Deliver OEM-Ready Programs
New “Build OEM Better” program poised to provide OEMs with ROI advantages.
San Jose, Calif.-based Bell Microproducts Inc., a value-added distributor of storage and computing technology, announced the expansion of its OEM-Ready programs and product offerings.†
Working with HP, Bell Microproducts is introducing Build OEM Better (BOB), a program in which the company will leverage its insight and access into embedded system manufacturers with HP’s technology components to offer ROI advantages to OEM business teams.
According to Gary Gammon, senior vice president of enterprise marketing for Bell Microproducts, “Bell Micro continues to define its real value-add role in the technology chain between technology manufacturers and OEM/VAR customers, with the continued expansion of its OEM-Ready programs defined as part of the BOB initiative. By applying our knowledge of how OEMs operate their businesses, Bell Micro has been able to define and offer OEM-specific services, which help them to save real dollars or increase their competitiveness in their own markets.”
With the Bell Micro OEM-Ready program, customers have the ability to quickly respond to custom requests as well as lower costs and accelerate delivery time, according to Bell Micro. By offering access to HP-branded technology combined with services such as product design, assembly, shipment, service, and support, Bell Micro is ready to assist its customers in bringing their products to market. Bell Micro aims to help customers save on costs associated with warehousing, auditing, insurance, integration, support, and shipping.
Designed to offer assistance at every stage in the OEM solution lifecycle, BOB introduces HP as Bell Microproducts’ industry standard building block for OEM customers and provides them with access to HP’s components.†With a newly launched sales portal and the power of Bell Microproducts’ 120 OEM sales representatives, Bell Microproducts is offering a new value proposition that it says goes beyond the traditional price and delivery benchmarks by which distributors are evaluated.†
†”OEMs can rarely foresee the hidden challenges and complexities that building their own off-the-shelf ‘white box’ systems entail,” notes Jerome Wendt, president and lead analyst for DCIG. “Bell Micro and HP’s new BOB program removes these complexities while giving them a trusted partner upon whom they can rely.”
For more information, visit www.buildoembetter.com.
